HANMI Semiconductor has announced plans to prototype its second-generation hybrid bonder for next-generation High Bandwidth Memory (HBM) production within the year, while also preparing to commence operations at a new hybrid bonder factory by 2027. This move is part of the company’s strategy to meet anticipated demand for hybrid bonding technology, which is expected to gain traction in mass production by 2029.
The significance of this development lies in the growing importance of hybrid bonding, which allows for direct copper interconnects between chips and wafers, enhancing performance by reducing package thickness and improving heat dissipation. As the semiconductor industry pushes for higher stack HBM configurations, HANMI’s advancements position it favorably in a competitive market, especially as JEDEC considers relaxing package height standards.
Investors should note that HANMI’s dual strategy of maintaining TC bonder revenues while advancing hybrid bonding technology could provide a stable growth trajectory, positioning the company as a key player in the evolving semiconductor landscape.
Source: semiconductor-digest.com